IEC TS 62239-2003 pdf – Process management for avionics – Preparation of an electronic components management plan

IEC TS 62239-2003 pdf – Process management for avionics – Preparation of an electronic components management plan.
1 Scope This Technical Specification defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the owners of a complete electronic components management plan are avionics equipment manufacturers. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC/PAS 62240, Use of semiconductor devices outside manufacturers’ specified temperature ranges 3 Terms definitions and abbreviations 3.1 Terms and definitions For the purposes of this Technical Specification, the following definitions apply. NOTE Plan owners may use alternative definitions consistent with convention within their company in their plan. 3.1.1 avionics equipment environment applicable environmental conditions (as described per the equipment specification) that the equipment shall be able to withstand without loss or degradation in equipment performance during all of its manufacturing cycle and maintenance life (the length of which is defined by the equipment manufacturer in conjunction with customers) 3.1.2 capable term used to indicate that a component can be used successfully in the intended application 3.1.3 certified indicates assessment and compliance to an applicable third party standard and maintenance of a certificate and registration (i.e. CECC, JAN, IECQ) 3.1.4 characterization process of testing a sample of components to determine the key electrical parameter values that can be expected of all produced components of the type tested
3.1.6 component manufacturer organization responsible for the component specification and its production 3.1.7 component obsolescence management range of management actions taken to avoid or resolve the effects of components not being procurable due to the manufacturer(s) ceasing production. Component obsolescence manage- ment should be considered an element of component dependability 3.1.8 component qualification process used to demonstrate that the component is capable of meeting its specification for all the required conditions and environments 3.1.9 component quality assurance all activities and processes to provide adequate confidence that each individual component meets the performance and environmental requirements 3.1.10 component selection process of choosing a specific component for a specific application 3.1.11 dependability capability of a product enabling it to achieve the specified functional performance at the appropriate time and for the planned duration, without damage to itself or its environment NOTE Dependability is generally characterised by the following four parameters: reliability, maintainability, availability, safety. 3.1.12 distributor organization contractually authorized by a manufacturer to store, split, repack and distribute completely finished components which have been declared by the manufacturer as conforming to their specifications. The distributor is responsible for providing any technical information and traceability information supplied by the component manufacturer 3.1.13 Electronic Components Management Plan ECMP equipment manufacturer’s document that defines the processes and practices for applying components to an equipment or range of equipment. Generally, it addresses all relevant aspects of controlling components during system design, development, production, and post- production support 3.1.14 electronic components electrical or electronic devices that are not subject to disassembly without destruction or impairment of design use.
3.1.16 obsolete component component which is no longer manufactured, and may or may not still be available 3.1.17 package type generic package family describing the physical outline and lead style EXAMPLES Plastic quad flat-package, ball grid array, chip scale package, SOIC package, SOT23 etc. 3.1.18 plan owner original design authority responsible for all aspects of the design, functionality and reliability of the delivered equipment in the intended application and is responsible for writing and maintaining their specific ECMP 3.1.19 risk measure of the potential inability to achieve overall program objectives within defined cost, schedule, and technical constraints 3.1.20 single event effect response of a component caused by the impact of galactic cosmic rays, solar enhanced particles and/or energetic neutrons and protons. The range of responses can include both non-destructive (for example upset) and destructive (for example latch-up or gate rupture) phenomena 3.1.21 subcontractor person or entity to whom the holder of obligations under a contract has delegated part or all of such obligations 3.1.22 substitute component component used as a replacement in equipment after the equipment design has been approved NOTE In some contexts, the term “alternate component” is used to describe a substitute component that is “equal to or better than” the original component. 3.1.23 validation method of qualifying components at the equipment manufacturer, when no in service data from prior use is available and there is no manufacturer’s qualification data to analyse