IEC 62258-1-2005 pdf – Semiconductor die products – Part 1: Requirements for procurement and use.
3 Terms and definitions For the purposes of this document, the following terms apply. NOTE 1 All terms defined here are in addition to relevant terms defined in IEC 60050: International Electrotechnical Vocabulary. NOTE 2 Additional terms and acronyms are given for information in Annexes A and B. 3.1 Basic definitions 3.1.1 die (singular or plural) separated piece(s) of semiconductor wafer that constitute(s) a discrete semiconductor or whole integrated circuit 3.1.2 wafer slice or flat disc, either of semiconductor material or of such a material deposited on a substrate, in which devices or circuits are simultaneously processed and which may be subsequently separated into die 3.1.3 singulated die individual and distinct die which have been separated from the wafer 3.1.4 bare die unpackaged discrete semiconductor or integrated circuit with pads on the upper surface suitable for interconnection to the substrate or package 3.1.5 bare die with connection structures unpackaged die that have had added bumps, lead frames or other terminations to interconnect for electrical attachment NOTE Typically these can be die that have had solder or other metallic bumps added to the metallized pads on the die in the form of peripheral bumps or arrays (also known as flip-chip) or die that have had fine leads attached to the metallized pads on the die known as TAB. 3.1.6 minimally packaged die MPD die that have had some exterior packaging medium and interconnection structure added for protection and ease of handling NOTE This definition includes such packaging technologies as chip scale packages (CSP) in which the area of the package is not significantly greater than the area of the bare die. 3.1.7 die device bare die, with or without connection structures, or a minimally packaged die 3.2 General terminology 3.2.1 chip common parlance for die
3.3.7 bond pads metallized areas on the die that are used for temporary or permanent electrical connection (bonding) 3.3.8 bumps raised metallized areas on the die that are used for temporary or permanent electrical connection 3.3.9 lead frame supporting structure upon which a die is mounted and which also includes the connection structure to which the die is bonded 3.3.10 die attach method and materials used to attach a die to a substrate 3.3.11 flip-chip semiconductor die which is electrically and/or mechanically connected to an interconnection structure in such a way that the active area faces the interconnection structure 3.3.12 interposer material placed between two surfaces giving electrical insulation, mechanical strength and/or controlled mechanical separation between the two surfaces NOTE An interposer may be used as a means for redistributing electrical connections and/or allowing for different thermal expansions between adjacent surfaces. 3.3.13 redistribution process of moving terminals on die to more convenient positions by additional connectivity layers or by the use of an interposer 4 General requirements 4.1 General Suppliers of die devices shall furnish information which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of products containing them. Details of the requirements are given below and in other parts of this standard. The form in which the information may be supplied is covered in IEC 62258-2. Whilst it is expected that much of the information supplied in conformance with this standard will be in the public domain and available from sources such as manufacturers’ data sheets, this specification does not place an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a non-disclosure agreement. For further details of requirements, refer to Clauses 6, 7, 8, 9, 10 and 11.
4.2 Identity All die devices shall have an identifier, consisting of one or more type designators, which shall distinguish each die device from all other die devices and from equivalent packaged parts. Such identifiers shall ensure the ability to distinguish among different versions of die which are intended to perform the same or different functions. 4.3 Source The source of supply for die devices shall be given with sufficient information for the customer to communicate adequately with the supplier. If the die manufacturer is different from the supplier, the identity of the manufacturer shall also be given. 4.4 Function A description of the electrical function and performance variants of all die devices shall be given. 4.5 Electrical and physical characteristics Electrical characteristics covering limiting conditions of use and normal operating conditions shall be given for all die devices. Technology of manufacture, including the materials used, shall be given where necessary.