IEC 62137-2004 pdf – Environmental and endurance testing – Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN.
1 Scope This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment. The test method specified in this standard is an integrated one by including the evaluation method of mounting methods, mounting conditions, printed circuit boards, soldering materials, and so on. It does not specify the evaluation method of the individual semiconductor devices. Mounting conditions, printed wiring boards, soldering materials, and so on significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard shall not be regarded as the one to be used to guarantee the mounting reliability of the semiconductor devices. The test method is not necessary if there is no stress (mechanical or others) from any of the tests covered in this standard. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1:1988, Environmental testing – Part 1: General and guidance IEC 60191-6-2:2001, Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
3 Terms and definitions For the purposes of this document, the terms and definitions for BGA, FBGA and so on, are referred to in IEC 60191-6-2 and IEC 60191-6-5. 4 Abbreviations FBGA fine-pitch ball grid array BGA ball grid array FLGA fine-pitch land grid array LGA land grid array SON small outline non-leaded package QFN quad flat-pack non-leaded package 5 Solder joint quality test methods 5.1 Reflow solderability test for solder joint 5.1.1 Purpose This test method specifies the reflow solderability test for the solder joint, as part of the specification in the standard. It is used to evaluate the solderability of reflow soldering of area-array type packages and peripheral terminal type packages (QFN and SON). 5.1.2 Test specimen The test specimen shall satisfy the following conditions: a) test board design (see Clause A.4); b) standard mounting process (see Annex B); c) resistance to reflow soldering (see Clause A.1), solderability test for test board land (see Clause A.2) and peel test method for test board land (see Clause A.3). 5.1.3 Test apparatus The test apparatus shall include the following: a) Oven The oven shall maintain the temperature specified in 22.214.171.124.
5.1.4 Test procedure 126.96.36.199 Initial measurement The initial measurement shall be carried out according to the items and conditions specified in the individual standard. 188.8.131.52 Moisture treatment The moisture treatment is desirable for the test because a soldering defect may occur with moisture. “Defect of soldering” is defined in ETR-7001 as general failure of soldering. a) Pre-treatment Unless otherwise specified in the individual standard, the specimen subject to the moistening reflow pre-treatment in b) shall be baked in the oven at (125 ± 5) °C for 24 h or more. b) Moistening process (1) The specimen shall be moistened as specified in the individual standard. If there is no such specification mentioned in the individual standard, the specimen shall be subject to the moistening condition at 30 °C, with a relative humidity of 70 % for 96 h. c) Moistening process (2) When the specimen is subjected to the reflow process twice, the specimen reflow soldered on the test board shall be moistened once again under the moistening condition as specified in the individual standard. In this case, by taking into consideration the moistening reflow characteristic of the test board, it is desirable to set both the moisture soaking conditions and the moistening time for the repeat version of the test. In general, it is desirable to set the moistening condition to 30 °C, with a relative humidity of 70 % , or to 30 °C, with a relative humidity of 85 % up to 165 h maximum.