IEC 60691-2002 pdf – Thermal-links – Requirements and application guide –

IEC 60691-2002 pdf – Thermal-links – Requirements and application guide –.
8 Documentation Delete all three NOTES in this Clause. Add the following new item e): e) thermal-links small in size and not intended to be replaced. NOTE 1 In order to avoid possible damage to the thermal-link, the manufacturer should be consulted when the end-use application involves sealing in or the use of cleaning solvents. NOTE 2 For reasons of safety, it should be made clear in the documentation that a thermal-link is a non- repairable item and that, in case of replacement, an equivalent thermal-link from the same manufacturer and having the same catalogue reference should be used, mounted in exactly the same way. NOTE 3 Catalogue or reference numbers should define those parameters such as temperature, current and voltage, which together classify a thermal-link. Page 25 9 Mechanical requirements Replace, on page 27, the fifth paragraph of Clause 9 by the following: For current-carrying parts, temperature limits should be considered according to Table 14.1 of IEC 60730-1. Page 29 9.1 Lead secureness tests Delete the last paragraph. 9.2 Tensile test Replace “10 min” by “1 min”. 9.3 Thrust test Replace “10 min” by “1 min”.
Replace, on page 43, the existing item g) by the following new item g): g) Compliance is checked by the following test. For thermal-links rated 249 °C or lower, the sample shall be placed in a test oven, stabilized at a temperature of T f – 12 K or as declared by the manufacturer, but not higher than 2 K below the lowest tolerance. For thermal-links rated at 250 °C or higher, and a tolerance of T f 0 20 − , the sample shall be placed in a test oven, stabilized at a temperature of T f – 22 K, or as declared by the manufacturer, but not higher than 2 K below the lowest tolerance. The temperature of the oven shall then re-stabilize. All thermal links, rated 249 °C or lower, and 250 °C or higher, shall then be energized and the oven temperature increased at the rate of (2 ± 1) K/min and the test shall be continued until the thermal-link functions or the oven temperature reaches 30 K above T f . NOTE 1 The thermal-link may operate immediately after being energized, in which case the temperature increase of (2 + 1) K is not necessary and the test may be stopped. Add the following new note at the end of 10.6.2: NOTE 2 The main purpose of this test is to evaluate the mechanical and electrical integrity of the thermal-link to interrupt a certain load. Page 45 10.8.2 Method Replace, in line 8, “.. of the appropriate size.” by “.. having a cross-sectional area as indicated in Table 10.2.1 of IEC 60730-1.”
11.2 Rated functioning temperature, T f Replace the existing subclause by the following: Thermal-links shall be exposed, in the test oven or oil bath, to T f – 12 K or as declared by the manufacturer but not higher than 2 K below the lowest tolerance for devices rated less than 250 °C, until the temperature has stabilized shown when two consecutive readings taken 5 min apart are within 1 K of each other. For devices rated 250 °C or higher, the thermal-links shall be exposed to T f – 22 K, or as declared by the manufacturer, but not higher than 2 K below the lowest tolerance. The temperature shall then be stabilized, shown when two consecutive readings taken 5 min apart are within 1 K of each other. The temperature shall then be increased steadily with a rate of rise between 0,5 K/min to 1 K/min, until all specimens have functioned. The individual functioning temperature of thermal-links, rated less than 250 °C, shall be recorded and they shall be not less than as declared by the manufacturer, or T f – 10 K if no declaration is made. For thermal-links rated at 250 °C or higher, the recorded temperature shall be not less than that declared by the manufacturer, or T f – 20 K if no declaration is made. For thermal-links rated lower than 250 °C, or higher than 250 °C, the temperature shall not be greater than T f . NOTE The equipment recommended for the tests of 11.2 is shown in Clause C.6. Page 49 11.3 Maximum temperature limit, T m Replace the first paragraph of 11.3 by the following: The specimens shall be subjected to T m 5 0 − °C for a period of 10 min. With the samples maintained at T m 5 0 − °C, a dielectric test per 10.3, and an insulation resistance test per 10.4, shall be conducted. Replace the word “NOTE” at the end of 11.3 by “NOTE 1” and add a new NOTE 2 as follows: NOTE 2 The T f and T m tests may be conducted in separate equipment and samples may cool down during transfer from the T f to T m test.